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Grinder
Single-Side Polisher
Double-Side Polisher
Wax Bonder / Wafer Scrubber
Chemical Mechanical Polisher
TMP-200S

  • Diameter of Plates

    530 mm

    • Features
    Pressurizing method
    Airbag pressure
    Drive mode
    Polishing head is rotates and swings at meantime
    Convenient processing
    The semi-automatic wafer loading and unloading system can be configured
    Good compatibility
    Compatible with 6-12 inch wafers
    Constant temperature control
    Temperature control system for polishing plate
    Control system
    PC program
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