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This series comprises special cleaning equipment for wafers after CMP, with a single-station single-chamber design. These machines can integrate PVA scrubbing, mega-sonic cleaning, N2 blow drying, high-speed spin drying, and other functions with a high degree of integration, and are suitable for cleaning various semiconductor wafers after CMP.
該系列為 CMP 后晶圓提供專用清洗設備，采用單工位單室設計。這些設備可集成 PVA 擦洗、超聲波清洗、氮氣吹干、高速脫水干燥等高度集成功能，適用于 CMP 后清洗各類半導體晶圓。