Fully-Automatic Grinder
TFG-3250
This equipment is a 3-spindle 4-station full-automatic thinning machine suitable for grinding 6/8-inch wafers. It is equipped with high-precision spindles, manipulator for loading/unloading, and integrates functions such as automatic centering, conveying and positioning, cleaning and drying to achieve full-automatic dry-in dry-out operation. The equipment has functions of automatic thickness measurement, multi-stage grinding, overload waiting, etc., featuring high processing accuracy and efficiency.
Number Of Work Stations 4
Grinding Wheel SpecificationOD303 mm
Maximum Wafer Size8 inch
Grinding Wheel Spindle Power9.5 kw
