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Fully-Automatic Grinder
TFG-2200/3200 series
This dual-spindle three-station fully-automatic grinder is suitable for grinding 6”/8” wafers; with high-precision spindle, the manipulator for loading and unloading, and integrating automatic alignment, transmission positioning, cleaning and drying functions, the equipment is able to realize the automatic operation of dry in and dry out. The equipment has the functions of automatic thickness measurement, multi-stage grinding, over-load waiting, etc., and the processing precision is high.
  • Maximum Wafer Size

    8 inch

  • Grinding Wheel Specification

    ?203(OD)mm

  • Grinding Wheel Spindle Power

    6 kw

  • Number Of Work Stations

    3

  • Features
    Comprehensive functions
    Automatic measurement of thickness, multi-stage grinding process, and overload standby
    Good compatibility
    Suitable for a variety of semiconductor materials, compatible to 6” & 8” wafers
    Abundant configurations
    Double-spindle grinding unit, three worktables
    Automatic system
    Automatic loading and unloading, wafer dry in and out