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This semi-automatic double spindle grinder is suitable for grinding 2”-12” wafers and materials to special specifications. In addition to manual loading, simple operations, and abundant functions, single and double-spindle processing modes are included. In double-spindle mode, the product is moved to the fine grinding position after rough grinding. It is also equipped with an automatic thickness measurement and compensation system to improve grinding accuracy. The operations surface can be customized according to customer requirements, achieving excellent results across a wide range of applications.