Fully Automatic Polisher
TFP-2310
This equipment is configured with 3 polishing stations and 8 polishing heads, featuring high processing efficiency. It is equipped with a polishing plate cooling and temperature monitoring system to ensure constant temperature during the polishing process. The automatic loading and unloading of wafers are realized through cassettes and manipulators, supporting a fully automatic dry-in wet-out processing mode. Compatible with different types of polishing liquids, it is suitable for polishing various semiconductor materials.
Polishing Plate SpecificationsOD630 mm
Polishing Plate Specifications3
Number of Polishing Heads4 groups of 8 polishing heads
