Single-Side Polisher
TAP-500/600 Dual series
This series of polishing machines comprises high-precision single-sided polishing equipment with double polishing discs to realize four-spindle simultaneous processing. The machines can be equipped with corresponding polishing heads for different wafers, fix wafers by vacuum adsorption, and pressurize using air bags. The polishing head can rotate and swing. They are suitable for polishing various semiconductor materials.
wafer size6 inch
Plate SpecificationsOD520 mm
Amount of polishing plate2
Amount of polishing head4
